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1 publication date: december 2010 ver. aeb data sheet part no. package code no. AN26130A xlga012-l-0303
AN26130A 2 ver. aeb contents ? overview ????????????????????.????????????????????? 3 ? features ???????????????????.?????????????????????? 3 ? applications ???????????????????.????????????????????? 3 ? package ???????????????????.??????????????????????. 3 ? type ?????????????????????.??????????????????????. 3 ? application circuit example (block diagram) ????.?????????????????????? 4 ? pin descriptions ????????????????.?????????????????????? 5 ? absolute maximum ratings ????????????.????????????????????? 6 ? operating supply voltage range ????????.????????? ?????????????? 6 ? allowable voltage range ???? ???????????? ???????????? ??????? 7 ? electrical characteristics ?????.????????????????????????????? 8 ? control pin mode table ?????? ????.????????????? ????????????. 10 ? truth table ??????????????????.??????????????????????. 10 ? technical data ????????????????.??????????????????????? 11 y i/o block circuit diagrams and pin f unction descriptions ?????????????? ???????. 11 y p d ? t a diagram ?????????????????????????????????????. 13 ? usage notes ????????????????. ????????????? ??????????. 14
AN26130A 3 ver. aeb AN26130A loop through amplifie r ic for vhf & uhf band (40 mhz to 900 mhz) applications ? overview y AN26130A is a loop through amplifier ic for vhf and uhf band (40 mhz to 900 mhz) applications. y realizing high performance by using 0.30 m bi-cmos process (ft = 20 ghz, fmax = 20 ghz). y off and loop through mode is changeable, contro lled by integrated cmos logic circuit. y achieving miniaturization by using small size package. ? features y 1-in, 2-out active loop through. y operation voltage +3.30 v typ. y current consumption 120 ma typ. (loop through mode) 0.1 a typ. (off through mode) y gain rf_out1 10.0 db typ. frx = 620 mhz, z 0 = 50 rf_out2 ? 4.0 db typ. frx = 620 mhz, z 0 = 50 y low noise figure rf_out1 4.0 db typ. frx = 620 mhz, z 0 = 50 y low distortion rf_out1 14.0 dbm typ. frx = 620 mhz, z 0 = 50 y small package (12 pin plastic package). ? applications y vhf & uhf band (40 mhz to 900 mhz) applications ? package y 12 pin fine pitch land grid array package (lga type) size : 3.00 mm 2.50 mm 0.80 mm ? type y bi?cmos ic
AN26130A 4 ver. aeb ? application circuit example (block diagram) notes) y this application circuit is an example. the operation of mass production set is not guaranteed. perform enough evaluation and verif ication on the design of mass production set. y this block diagram is for explaining functions. the part of the block diagram may be omitte d, or it may be simplified. rf_in logic vcnt l1 c4 otout v dd nc c1 c2 rf_out1 l2 10 9 8 7 13456 fin fin 11 ltout 12 trans1 rf_out2 c3 2 att in att out r3 r1 r2 att cnt out1 in
AN26130A 5 ver. aeb ? pin descriptions off through output output ot out 11 v ss ground v ss3 10 rf input input in 9 v ss ground v ss2 8 non connect nc nc 7 v ss ground v ss1 1 att input input att in 2 loop through output output lt out 12 v dd power supply v dd 4 rf output 1 output out1 5 off and loop through mode control input input cnt 6 att output output att out 3 v ss ground v ss4 fin description type pin name pin no.
AN26130A 6 ver. aeb ? absolute maximum ratings ? ma 170 i dd supply current 2 notes unit rating symbol parameter a no. *3 c ?40 to +150 t stg storage temperature 5 *3 c ?20 to +80 t opr operating ambient temperature 4 *2 mw 65.5 p d power dissipation 3 *1 v 3.6 v dd supply voltage 1 notes) *1 : the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : the power dissipation shown is the value at t a = 80 c for the independent (unmounted) ic package without a heat sink. when using this ic, refer to ? p d -t a diagram in the ? technical data standard and design the heat radi ation with sufficient margin so that the allowable value might not be exceeded based on the conditi ons of power supply voltage, load, and ambient temperature. *3 : except for the power dissipation, operating ambient temp erature, and storage temperature, all ratings are for t a = 25 c. ? operating supply voltage range supply voltage range *1 notes unit range symbol parameter v 3.13 to 3.47 v dd note) *1 : the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. note) absolute maximum ratings are limit values which do not resu lt in damages to this ic, and ic operation is not guaranteed at t hese limit values .
AN26130A 7 ver. aeb ? allowable voltage range notes) y allowable current and voltage ranges are limit ranges which do no t result in damages to this ic, and ic operation is not guaran teed within these limit ranges. y do not apply voltage to n.c. pins. y voltage values are with respect to the gnd. y applying external voltage to any pin not mentioned below l eads to the malfunction and the damage of the device. y below ratings are specified for prevention of malf unction and stress, not for guaranteed operation. notes) *1 : rf signal input pin (maximum input power is +17dbm). do not apply dc current. *2 : rf signal output pin. do not apply dc current. *3 : rf signal output pin with dc current. do not apply a voltage different from v dd voltage. *2 v ? 0.3 to (v dd + 0.3) ot out 11 *3 v (v dd ? 0.05) to (v dd + 0.05) att out 3 *3 v (v dd ? 0.05) to (v dd + 0.05) out1 5 ? v ? 0.3 to (v dd + 0.3) cnt 6 *1 v ? att in 2 ? 0.3 to (v dd + 0.3) lt out notes unit rating pin name pin no. *1 v ? in 9 *2 v 12
AN26130A 8 ver. aeb ? ma 160 120 ? v dd current at loop through mode no input signal i dd lt supply current lt dc-1 ? a 10 0.1 ? v dd current at off through mode no input signal i dd ot supply current ot dc-2 ? v ? 3.30 2.805 vih = v dd 0.85 vih sw voltage (loop through mode) dc-3 ? v 0.33 0.0 ? vil = v dd 0.10 vil sw voltage (off through mode) dc-4 ? a 10 3.3 ? current at cnt pin vih = v dd iih sw current (high) dc-5 dc electrical characteristics limits typ unit max notes min conditions symbol parameter b no. ? electrical characteristics at v dd = 3.30 v note) t a = 25 c 2 c unless otherwise specified.
AN26130A 9 ver. aeb ? db ? 2.0 ? 4.0 ? 6.0 off through mode f = frx gots off through gain out2 a-3 ? db ? 1.0 ? 4.0 ? 7.0 loop through mode f = frx glts loop through gain out2 a-2 ? db 12.5 10 7.5 loop through mode f = frx g1s power gain out1 a-1 ? dbm ? 14.0 8.0 loop through mode out1 f1 = frx f2 = frx + 10 mhz input 2 signals (f1, f2) iip311s iip3 + 10 mhz offset out1 loop through a-4 ac electrical characteristics limits typ unit max notes min conditions symbol parameter b no. ? electrical characteristics (continued) at v dd = 3.30 v note) t a = 25 c 2 c, frx = 620 mhz, prx = ?15 dbm, z 0 = 50 , cw unless otherwise specified.
AN26130A 10 ver. aeb ? control pin mode table note) control voltage range : see b no . dc-3 / b no. dc-4 at page 8 pin voltage loop through high ? off through loop through/off through switching (mode control) 6 remarks low description pin no. ? truth table note) control voltage range : see b no . dc-3 / b no. dc-4 at page 8 loop through loop through high mode ic cnt off through off through low
AN26130A 11 ver. aeb out1 (rf output 1), att out (att output) ? 3,5 in (rf input) 1.4 v 9 v ss (ground) ? 0.0 v 1,8,10,12 cnt (loop through/off through mode control input) ? 6 v dd (power supply) 3.30 v 4 otout (loop through output), ltout (off through output) ? 11,12 descriptions internal circuit voltage pin no.1 ? technical data y i/o block circuit diagrams and pin function descriptions note) the characteristics listed below a re reference values derived from the de sign of the ic and are not guaranteed. 9 6 4 v dd v dd v ss v dd v ss v ss v ss v ss v dd 3 11
AN26130A 12 ver. aeb att in (att input) ? 2 descriptions internal circuit voltage pin no. ? technical data (continued) y i/o block circuit diagrams and pin function descriptions (continued) note) the characteristics listed below are reference values derived from the design of the ic and are not guaranteed. 2 v dd v ss
AN26130A 13 ver. aeb ? technical data (continued) y p d ? t a diagram
AN26130A 14 ver. aeb y special attention and precaution in using 1. this ic is intended to be used for general electronic equipment [tv]. consult our sales staff in advance for in formation on the foll owing applications: x special applications in which ex ceptional quality and reli ability are required, or if the fail ure or malfunction of this ic may directly jeopardize life or harm the human body. x any applications other than the standard applications intended. (1) space appliance (such as artificial satellite, and rocket) (2) traffic control equipment (such as fo r automobile, airplane, train, and ship) (3) medical equipment for life support (4) submarine transponder (5) control equipment for power plant (6) disaster prevention and security device (7) weapon (8) others : applications of which reliability equivalent to (1) to (7) is required it is to be understood that our company shall not be held respons ible for any damage incurred as a result of or in connection w ith your using the ic described in this book for any special applicatio n, unless our company agrees to your using the ic in this bo ok for any special application. 2. pay attention to the direction of lsi. when mounting it in the wrong direction onto the pcb (printed-circuit-board), it might smoke or ignite. 3. pay attention in the pcb (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. in addition, refer to the pin description for the pin configuration. 4. perform a visual inspection on the pcb be fore applying power, otherwise damage might happen due to problems such as a solder- bridge between the pins of the semiconductor device. also, perfo rm a full technical verification on the assembly quality, becau se the same damage possibly can happen due to conductive substanc es, such as solder ball, that adhere to the lsi during transportation. 5. take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin- v cc short (power supply fault), output pin-gnd short (ground fault), or output-to-output-pin short (load short) . and, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage a nd operating environment etc.). esp ecially, please be careful not to exceed the range of absolu te maximum rating on the transient state, such as power-on, power-off and mode -switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, ta ke into the consideration of incidence of break down and failur e mode, possible to occur to semiconductor produc ts. measures on the system s such as redundant design, arresting the spread of fi re or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the produ cts. 7. when using the lsi for new models, verify the safe ty including the long-term reliability for each product. 8. when the application system is designed by using this lsi, be sure to confirm notes in this book. be sure to read the notes to descriptions and the usage notes in the book. ? usage notes
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202

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